NOTE:
G/F OVER 1um(40u")MIN Ni OVER ALL
PEAK TEMP. FOR 10 SEC. IN A WAVE SOLDER APPLICATION
4. THE HSG. WILL WITHSTAND EXPOSURE TO 260C
PACKING SPEC: GS-14-1420
PRODUCT SPEC: GS-12-629
3. SPEC.:
HOUSING: HIGH TEMP PLASTIC, UL94-V0,BLACK
1. MATERIAL,
TERMINAL: COPPER ALLOY , SQ=0.40±0.03MM
TERMINAL: GOLD AT CONTACT,
2. FINISH:
T: TUBE
LEAD FREE
PLATING:
1:GOLD FLASH ALL OVER
4:0.25um(10U")GOLD AT CONTACT
8:0.76um(30U")GOLD AT CONTACT
PACKING
SEE TABLE 1
PIN COUNT
5. PRODUCT NUMBERING:
20021611 - 0 0 0 XX X X LF
WITH A PCB.
9:1u" GOLD OVER 30u" PdNi AT CONTACT
PDS: Rev :C STATUS:Released Printed: Mar 02, 2012
