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MAIN PRODUCT APPLICATIONS:
EMI filtering and ESD protection for:
■ SIM Interface (Subscriber Identify Module)
■ UIM Interface (Universal Identify Module)
DESCRIPTION
The EMIF03-SIM01F2 is a highly integrated
devices designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic interfer-
ences. The EMIF03 flip chip packaging means the
package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15kV.
BENEFITS
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Lead free package
■ Very low PCB space consuming:
1.42mm x 1.42mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration & wafer level packaging.
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 15kV (air discharge)
8kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
EMIF03-SIM01F2
3 LINES EMI FILTER
INCLUDING ESD PROTECTION
REV. 2December 2004
Figure 2: Configuration
47 Ω
CLK in
Data in
CLK out
Data out
100 Ω
R1
R2
R3
RST in RST out
100 Ω
V
CC
GND
Cline = 35pF max.
Flip-Chip
(8 Bumps)
Figure 1: Pin Configuration (Ball side)
B
C
123
A
RST
in
RST
out
CLT
in
Data
in
Gnd
V
CC
CLT
out
Data
out
TM: IPAD is a trademark of STMicroelectronics.
Table 1: Order Code
Part Number Marking
EMIF03-SIM01F2 FC
IPAD™
